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? semiconductor components industries, llc, 2013 march, 2013 ? rev. 1 1 publication order number: NOA3302/d NOA3302 digital proximity sensor with ambient light sensor and interrupt description the NOA3302 combines an advanced digital proximity sensor and led driver with an ambient light sensor (als) and tri ? mode i 2 c interface with interrupt capability in an integrated monolithic device. multiple power management features and very low active sensing power consumption directly address the power requirements of battery operated mobile phones and mobile internet devices. the proximity sensor measures reflected light intensity with a high degree of precision and excellent ambient light rejection. the NOA3302 enables a proximity sensor system with a 32:1 programmable led drive current range and a 30 db overall proximity detection threshold range. the photopic light response, dark current compensation and high sensitivity of the ambient light sensor eliminates inaccurate light level detection, insuring proper backlight control even in the presence of dark cover glass. the NOA3302 is ideal for improving the user experience by enhancing the screen interface with the ability to measure distance for near/far detection in real time and the ability to respond to ambient lighting conditions to control display backlight intensity. features ? proximity sensor, led driver and als in one device ? very low power consumption ? stand ? by current 5 a (monitoring i 2 c interface only, v dd = 3 v) ? als operational current 50 a ? proximity sensing average operational current 100 a ? average led sink current 75 a proximity sensing ? proximity detection distance threshold i 2 c programmable with 12 ? bit resolution and four integration time ranges (15 ? bit effective resolution) ? effective for measuring distances up to 100 mm and beyond ? excellent ir and ambient light rejection including sunlight (up to 50k lux) and cfl interference ? programmable led drive current from 5 ma to 160 ma in 5 ma steps, no external resistor required ambient light sensing ? als senses ambient light and provides a 16 ? bit output count on the i 2 c bus directly proportional to the ambient light intensity ? photopic spectral response nearly matches human eye ? dynamic dark current compensation ? linear response over the full operating range ? senses intensity of ambient light from 0.05 lux to 52k lux with 21 ? bit effective resolution (16 ? bit converter) ? continuously programmable integration times (6.25 ms, 12.5 ms, 25 ms to 800 ms) ? precision on ? chip oscillator (counts equal 0.1 lux at 100 ms integration time) cwdfn8 cu suffix case 505aj http://onsemi.com ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our t ape and reel packaging specifications brochure, brd8011/d. *temperature range: ? 40 c to 80 c. device package shipping ? ordering information NOA3302cutag* cwdfn8 (pb ? free) 2500 / tape & reel pin connections 1 2 3 6 5 7 vdd led_gnd led scl sda nc (top view) int vss 4 8 1
NOA3302 http://onsemi.com 2 additional features ? programmable interrupt function including independent upper and lower threshold detection or threshold based hysteresis for proximity and or als ? proximity persistence feature reduces interrupts by providing hysteresis to filter fast transients such as camera flash ? automatic power down after single measurement or continuous measurements with programmable interval time for both als and ps function ? wide operating voltage range (2.3 v to 3.6 v) ? wide operating temperature range ( ? 40 c to 80 c) ? i 2 c serial communication port ? standard mode ? 100 khz ? fast mode ? 400 khz ? high speed mode ? 3.4 mhz ? no external components required except the ir led and power supply decoupling caps ? 8 ? lead cudfn 2.0 x 2.0 x 0.6 mm clear package ? these devices are pb ? free, halogen free/bfr free and are rohs compliant applications ? senses human presence in terms of distance and senses ambient light conditions, saving display power in applications such as: ? smart phones, mobile internet devices, mp3 players, gps ? mobile device displays and backlit keypads figure 1. NOA3302 application block diagram adc h als photodiode reference diode sda scl intb h proximity photodiode adc dsp dsp osc & control led vdd vss ir led vdd vdd_i2c sda scl intb mcu NOA3302 led drive led_gnd 1 f i 2 c interface 1 f 22 f table 1. pin function description pin pin name description 1 vdd power pin. 2 vss ground pin. 3 led_gnd ground pin for ir led driver. 4 led ir led output pin. 5 int interrupt output pin, open ? drain. 6 nc not connected. 7 sda bi ? directional data signal for communications with the i 2 c master. 8 scl external i 2 c clock supplied by the i 2 c master.
NOA3302 http://onsemi.com 3 table 2. absolute maximum ratings rating symbol value unit input power supply vdd 4.0 v input voltage range v in ? 0.3 to vdd + 0.2 v output voltage range v out ? 0.3 to vdd + 0.2 v maximum junction temperature t j(max) 100 c storage temperature t stg ? 40 to 80 c esd capability, human body model (note 1) esd hbm 2 kv esd capability, charged device model (note 1) esd cdm 500 v esd capability, machine model (note 1) esd mm 200 v moisture sensitivity level msl 3 ? lead temperature soldering (note 2) t sld 260 c stresses exceeding maximum ratings may damage the device. maximum ratings are stress ratings only. functional operation above t he recommended operating conditions is not implied. extended exposure to stresses above the recommended operating conditions may af fect device reliability. 1. this device incorporates esd protection and is tested by the following methods: esd human body model tested per eia/jesd22 ? a114 esd charged device model tested per esd ? stm5.3.1 ? 1999 esd machine model tested per eia/jesd22 ? a115 latchup current maximum rating: 100 ma per jedec standard: jesd78 2. for information, please refer to our soldering and mounting techniques reference manual, solderrm/d table 3. operating ranges rating symbol min typ max unit power supply voltage vdd 2.3 3.6 v power supply current, stand ? by mode (vdd = 3.0 v) idd stby_3.0 5 a power supply current, stand ? by mode (vdd = 3.6 v) idd stby_3.6 10 a power supply average current, als operating 100 ms integration time and 500 ms intervals idd als 50 a power supply average current, ps operating 300 s integration time and 100 ms intervals idd ps 100 a led average sink current, ps operating at 300 s integration time and 100 ms intervals and led current set at 50 ma i led 75 a i 2 c signal voltage (note 3) vdd_i2c 1.6 1.8 2.0 v low level input voltage (vdd_i2c related input levels) v il ? 0.3 0.3 vdd_i2c v high level input voltage (vdd_i2c related input levels) v ih 0.7 vdd_i2c vdd_i2c + 0.2 v hysteresis of schmitt trigger inputs v hys 0.1 vdd_i2c v low level output voltage (open drain) at 3 ma sink current (intb) v ol 0.2 vdd_i2c v input current of io pin with an input voltage between 0.1 vdd and 0.9 vdd i i ? 10 10 a output low current (intb) i ol 3 ? ma operating free ? air temperature range t a ? 40 80 c 3. the i 2 c interface is functional to 3.0 v, but timing is only guaranteed up to 2.0 v. high speed mode is guaranteed to be functional t o 2.0 v.
NOA3302 http://onsemi.com 4 table 4. electrical characteristics (unless otherwise specified, these specifications apply over 2.3 v < vdd < 3.3 v, 1.7 v < vdd_i2c < 1.9 v, ? 40 c < t a < 80 c, 10 pf < cb < 100 pf) (see note 4) parameter symbol min typ max unit led pulse current i led_pulse 5 160 ma led pulse current step size i led_pulse_step 5 ma led pulse current accuracy i led_acc ? 20 +20 % interval timer tolerance to l f_timer ? 35 +35 % scl clock frequency f scl_std 10 100 khz f scl_fast 100 400 f scl_hs 100 3400 hold time for start condition. after this period, the first clock pulse is generated. t hd;sta_std 4.0 ? s t hd;sta_fast 0.6 ? t hd;sta_hs 0.160 ? low period of scl clock t low_std 4.7 ? s t low_fast 1.3 ? t low_hs 0.160 ? high period of scl clock t high_std 4.0 ? s t high_fast 0.6 ? t high_hs 0.060 ? sda data hold time t hd;dat_d_std 0 3.45 s t hd;dat_d_fast 0 0.9 t hd;dat_d_hs 0 0.070 sda data set ? up time t su;dat_std 250 ? ns t su;dat_fast 100 ? t su;dat_hs 10 rise time of both sda and scl (input signals) (note 5) t r_input_std 20 1000 ns t r_input_fast 20 300 t r_input_hs 10 40 fall time of both sda and scl (input signals) (note 5) t f_input_std 20 300 ns t f_input_fast 20 300 t f_input_hs 10 40 rise time of sda output signal (note 5) t r_out_std 20 300 ns t r_out_fast 20 + 0.1 cb 300 t r_out_hs 10 80 fall time of sda output signal (note 5) t f_out_std 20 300 ns t f_out_fast 20 + 0.1 cb 300 t f_out_hs 10 80 set ? up time for stop condition t su;sto_std 4.0 ? s t su;sto_fast 0.6 ? t su;sto_hs 0.160 ? bus free time between stop and start condition t buf_std 4.7 ? s t buf_fast 1.3 ? t buf_hs 0.160 ? 4. refer to figure 2 and figure 3 for more information on ac characteristics. 5. the rise time and fall time are dependent on both the bus capacitance (cb) and the bus pull ? up resistor r p. max and min pull ? up resistor values are determined as follows: r p(max) = t r (max) /(0.8473 x cb) and r p(min) = (vdd_i2c ? v ol(max) )/i ol . 6. cb = capacitance of one bus line, maximum value of which including all parasitic capacitances should be less than 100 pf. bus capacitance up to 400 pf is supported, but at relaxed timing.
NOA3302 http://onsemi.com 5 table 4. electrical characteristics (unless otherwise specified, these specifications apply over 2.3 v < vdd < 3.3 v, 1.7 v < vdd_i2c < 1.9 v, ? 40 c < t a < 80 c, 10 pf < cb < 100 pf) (see note 4) (continued) parameter unit max typ min symbol capacitive load for each bus line (including all parasitic capacitance) (note 6) c b 10 100 pf noise margin at the low level (for each connected device ? including hysteresis) v nl 0.1 vdd ? v noise margin at the high level (for each connected device ? including hysteresis) v nh 0.2 vdd ? v 4. refer to figure 2 and figure 3 for more information on ac characteristics. 5. the rise time and fall time are dependent on both the bus capacitance (cb) and the bus pull ? up resistor r p. max and min pull ? up resistor values are determined as follows: r p(max) = t r (max) /(0.8473 x cb) and r p(min) = (vdd_i2c ? v ol(max) )/i ol . 6. cb = capacitance of one bus line, maximum value of which including all parasitic capacitances should be less than 100 pf. bus capacitance up to 400 pf is supported, but at relaxed timing. table 5. optical characteristics (unless otherwise specified, these specifications are for vdd = 3.3 v, t a = 25 c) parameter symbol min typ max unit ambient light sensor spectral response, peak (note 7) p 560 nm spectral response, low ? 3 db c_low 510 nm spectral response, high ? 3 db c_high 610 nm dynamic range dr als 0.05 52k lux maximum illumination (als operational but saturated) e v_max 120k lux resolution, counts per lux, tint = 800 ms cr 800 80 counts resolution, counts per lux, tint = 100 ms cr 100 10 counts resolution, counts per lux, tint = 6.25 ms cr 6.25 6.25 counts illuminance responsivity, green 560 nm led, ev = 100 lux, tint = 100 ms r v_g100 1000 counts illuminance responsivity, green 560 nm led, ev = 1000 lux, tint = 100 ms r v_g1000 10000 counts dark current, ev = 0 lux, tint = 100 ms r vd 0 0 3 counts proximity sensor detection range, tint = 1200 s, i led = 100 ma, 860 nm ir led (osram sfh4650), white reflector (rgb = 220, 224, 223), snr = 6:1 d ps_1200_white 100 mm detection range, tint = 600 s, i led = 100 ma, 860 nm ir led (osram sfh4650), white reflector (rgb = 220, 224, 223), snr = 6:1 d ps_600_white 85 mm detection range, tint = 300 s, i led = 100 ma, 860 nm ir led (osram sfh4650), white reflector (rgb = 220, 224, 223), snr = 6:1 d ps_300_white 60 mm detection range, tint = 150 s, i led = 100 ma, 860 nm ir led (osram sfh4650), white reflector (rgb = 220, 224, 223), snr = 6:1 d ps_150_white 35 mm detection range, tint = 1200 s, i led = 100 ma, 860 nm ir led (osram sfh4650), grey reflector (rgb = 162, 162, 160), snr = 6:1 d ps_1200_grey 70 mm detection range, tint = 1200 s, i led = 100 ma, 860 nm ir led (osram sfh4650), black reflector (rgb = 16, 16, 15), snr = 6:1 d ps_1200_black 35 mm saturation power level p dmax 1.0 mw/cm 2 measurement resolution, tint = 150 s mr 150 12 bits measurement resolution, tint = 300 s mr 300 13 bits measurement resolution, tint = 600 s mr 600 14 bits measurement resolution, tint = 1200 s mr 1200 15 bits 7. refer to figure 4 for more information on spectral response.
NOA3302 http://onsemi.com 6 figure 2. ac characteristics, standard and fast modes figure 3. ac characteristics, high speed mode
NOA3302 http://onsemi.com 7 typical characteristics figure 4. als spectral response (normalized) figure 5. als light source dependency (normalized to fluorescent light) wavelength (nm) ratio 900 800 700 600 500 400 300 200 0 0.1 0.2 0.4 0.6 0.7 0.9 1.0 2.0 1.5 1.0 0.5 0 figure 6. als response to white light vs. angle figure 7. als response to ir vs. angle figure 8. als linearity 0 ? 700 lux figure 9. als linearity 0 ? 100 lux ev (lux) ev (lux) 700 600 500 400 300 200 100 0 0 1 k 2 k 3 k 4 k 6 k 7 k 8 k 80 70 60 50 30 20 10 0 0 200 400 600 800 1000 1200 output current (normalized) als counts als counts 800 5 k 40 90 100 110 incandescent (2850k) fluorescent (2700k) white led (5600k) fluorescent (5000k) 1000 0.3 0.5 0.8 als human eye 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 150 160 170 180 ? 170 ? 160 ? 150 ? 140 ? 130 ? 120 ? 110 ? 100 ? 90 ? 80 ? 70 ? 60 ? 50 ? 40 ? 30 ? 20 ? 10 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 150 160 170 180 ? 170 ? 160 ? 150 ? 140 ? 130 ? 120 ? 110 ? 100 ? 90 ? 80 ? 70 ? 60 ? 50 ? 40 ? 30 ? 20 ? 10 side view top view ? 90 o 90 o 1 2 8 7 6 45 3 side view top view ? 90 o 90 o 1 2 8 7 6 45 3
NOA3302 http://onsemi.com 8 typical characteristics figure 10. als linearity 0 ? 10 lux figure 11. als linearity 0 ? 2 lux ev (lux) ev (lux) 10 8 7 6 4 3 1 0 0 20 40 60 100 120 2.5 2.0 1.5 1.0 0.5 0 0 5 10 15 20 25 figure 12. ps response vs. distance and led current (1200 s integration time, grey reflector (rgb = 162, 162, 160)) figure 13. ps response vs. distance and led current (300 s integration time, white reflector (rgb = 220, 224, 223)) distance (mm) distance (mm) 140 120 100 80 60 40 20 0 0 5 k 10 k 20 k 25 k 30 k 40 k 45 k figure 14. ps response vs. distance and led current (300 s integration time, grey reflector (rgb = 162, 162, 160)) figure 15. ps response vs. distance and led current (300 s integration time, black reflector (rgb = 16, 16, 15)) distance (mm) distance (mm) 140 120 100 80 60 40 20 0 0 2 k 4 k 6 k 8 k 10 k 12 k 100 80 60 40 20 0 0 500 1500 2000 3000 3500 4000 5000 als counts als counts proximity sensor value proximity sensor value proximity sensor value proximity sensor value 1000 2500 4500 20ma 60ma 100ma 160ma 160 20ma 60ma 100ma 160ma 80 25 911 160 15 k 35 k 20ma 60ma 100ma 160ma 200 100 150 50 0 0 2 k 4 k 6 k 8 k 10 k 12 k 250 20ma 60ma 100ma 160ma
NOA3302 http://onsemi.com 9 typical characteristics v dd (v) v dd (v) 4.0 3.5 3.0 2.5 2.0 0 10 30 40 60 70 90 100 4.0 3.5 3.0 2.5 2.0 0 50 100 150 200 250 300 i dd ( a) i dd ( a) als ps als+ps 20 50 80 als ps als+ps 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 150 160 170 180 ? 170 ? 160 ? 150 ? 140 ? 130 ? 120 ? 110 ? 100 ? 90 ? 80 ? 70 ? 60 ? 50 ? 40 ? 30 ? 20 ? 10 side view top view ? 90 o 90 o 1 2 8 7 6 45 3 temperature ( c) 100 80 60 40 20 0 0 0.2 0.4 0.6 0.8 1.0 1.2 als response (normalized) 100 lux 50 lux 20 lux 10 lux 5 lux figure 16. ps ambient rejection t int = 300 s, i led = 100 ma, white reflector (rgb = 220, 224, 223) figure 17. ps response to ir vs. angle figure 18. supply current vs. supply voltage als t int = 100 ms, t r = 500 ms ps t int = 300 s, t r = 100 ms figure 19. supply current vs. supply voltage als t int = 100 ms, t r = 500 ms ps t int = 1200 s, t r = 50 ms figure 20. als response vs. temperature reflector distance (mm) proximity sensor value 200 100 150 50 0 0 2 k 4 k 6 k 8 k 10 k 12 k 250 no ambient 50k lux halogen (3300k) 10k lux incandescent (2700k) 10k lux cfl (3000k)
NOA3302 http://onsemi.com 10 description of operation proximity sensor architecture NOA3302 combines an advanced digital proximity sensor, led driver, ambient light sensor and a tri ? mode i 2 c interface as shown in figure 1. the led driver draws a modulated current through the external ir led to illuminate the target. the led current is programmable over a wide range. the infrared light reflected from the target is detected by the proximity sensor photo diode. the proximity sensor employs a sensitive photo diode fabricated in on semiconductor?s standard cmos process technology. the modulated light received by the on ? chip photodiode is converted to a digital signal using a variable slope integrating adc with a default resolution (at 300 s) of 13 ? bits, unsigned. the signal is processed to remove all unwanted signals resulting in a highly selective response to the generated light signal. the final value is stored in the ps_data register where it can be read by the i 2 c interface. ambient light sensor architecture the ambient light sensor contained in the NOA3302 employs a second photo diode with its own proprietary photopic filter limiting extraneous photons, and thus performing as a band pass filter on the incident wave front. the filter only transmits photons in the visible spectrum which are primarily detected by the human eye. the photo response of this sensor is as shown in figure 4. the ambient light signal detected by the photo diode is converted to digital signal using a variable slope integrating adc with a resolution of 16 ? bits, unsigned. the adc value is stored in the als_data register where it can be read by the i 2 c interface. equation 1 shows the relationship of output counts c nt as a function of integration constant i k , integration time t int (in seconds) and the intensity of the ambient light, i l (in lux), at room temperature (25 c). i l c nt i k t int (eq. 1) where: i k = 73 (for fluorescent light) i k = 106 (for incandescent light) hence the intensity of the ambient fluorescent light (in lux): i l c nt 73 t int (eq. 2) and the intensity of the ambient incandescent light (in lux): i l c nt 106 t int (eq. 3) for example let: c nt = 7300 t int = 100 ms intensity of ambient fluorescent light, i l (in lux): i l 7300 73 100 ms (eq. 4) i l = 1000 lux i 2 c interface the NOA3302 acts as an i 2 c slave device and supports single register and block register read and write operations. all data transactions on the bus are 8 bits long. each data byte transmitted is followed by an acknowledge bit. data is transmitted with the msb first. figure 21 shows an i 2 c write operation. write transactions begin with the master sending an i 2 c start sequence followed by the seven bit slave address (NOA3302 = 0x37) and the write(0) command bit. the NOA3302 will acknowledge this byte transfer with an appropriate ack. next the master will send the 8 bit register address to be written to. again the NOA3302 will acknowledge reception with an ack. finally, the master will begin sending 8 bit data segment(s) to be written to the NOA3302 register bank. the NOA3302 will send an ack after each byte and increment the address pointer by one in preparation for the next transfer. write transactions are terminated with either an i 2 c stop or with another i 2 c start (repeated start). 788 a[6:0] d[7:0] d[7:0] write ack ack ack device address register address register data start condition stop condition 011 0111 0 0 0000 0000 0000 0110 00 0x6e figure 21. i 2 c write command
NOA3302 http://onsemi.com 11 figure 22 shows an i 2 c read command sent by the master to the slave device. read transactions begin in much the same manner as the write transactions in that the slave address must be sent with a write(0) command bit. 788 a[6:0] d[7:0] d[7:0] write ack ack ack device address register address register data start condition stop condition 011 0111 0 0 0000 0000 0000 0110 00 0x6e 788 a[6:0] d[7:0] d[7:0] read ack ack nack device address register data [a] register data [a+1] start condition stop condition 011 0111 1 0 bbbb bbbb bbbb bbbb 01 0x6f figure 22. i 2 c read command after the NOA3302 sends an ack, the master sends the register address as if it were going to be written to. the NOA3302 will acknowledge this as well. next, instead of sending data as in a write, the master will re ? issue an i 2 c start (repeated start) and again send the slave address and this time the read(1) command bit. the NOA3302 will then begin shifting out data from the register just addressed. if the master wishes to receive more data (next register address), it will ack the slave at the end of the 8 bit data transmission, and the slave will respond by sending the next byte, and so on. to signal the end of the read transaction, the master will send a nack bit at the end of a transmission followed by an i 2 c stop. the NOA3302 also supports i 2 c high ? speed mode. the transition from standard or fast mode to high ? speed mode is initiated by the i 2 c master. a special reserve device address is called for and any device that recognizes this and supports high speed mode immediately changes the performance characteristics of its i/o cells in preparation for i 2 c transactions at the i 2 c high speed data protocol rates. from then on, standard i 2 c commands may be issued by the master, including repeated start commands. when the i 2 c master terminates any i 2 c transaction with a stop sequence, the master and all slave devices immediately revert back to standard/fast mode i/o performance. by using a combination of high ? speed mode and a block write operation, it is possible to quickly initialize the NOA3302 i 2 c register bank.
NOA3302 http://onsemi.com 12 NOA3302 data registers NOA3302 operation is observed and controlled by internal data registers read from and written to via the external i 2 c interface. registers are listed in table 6. default values are set on initial power up or via a software reset command (register 0x01). the i 2 c slave address of the NOA3302 is 0x37. table 6. NOA3302 data registers address type name description 0x00 r part_id NOA3302 part number and revision ids 0x01 rw reset software reset control 0x02 rw int_config interrupt pin functional control settings 0x0f rw ps_led_current ps led pulse current (5, 10, , 160 ma) 0x10 rw ps_th_up_msb ps interrupt upper threshold, most significant bits 0x11 rw ps_th_up_lsb ps interrupt upper threshold, least significant bits 0x12 rw ps_th_lo_msb ps interrupt lower threshold, most significant bits 0x13 rw ps_th_lo_lsb ps interrupt lower threshold, least significant bits 0x14 rw ps_filter_config ps filter configuration 0x15 rw ps_config ps integration time configuration 0x16 rw ps_interval ps interval time configuration 0x17 rw ps_control ps operation mode control 0x20 rw als_th_up_msb als interrupt upper threshold, most significant bits 0x21 rw als_th_up_lsb als interrupt upper threshold, least significant bits 0x22 rw als_th_lo_msb als interrupt lower threshold, most significant bits 0x23 rw als_th_lo_lsb als interrupt lower threshold, least significant bits 0x24 rw reserved reserved 0x25 rw als_config als integration time configuration 0x26 rw als_interval als interval time configuration 0x27 rw als_control als operation mode control 0x40 r interrupt interrupt status 0x41 r ps_data_msb ps measurement data, most significant bits 0x42 r ps_data_lsb ps measurement data, least significant bits 0x43 r als_data_msb als measurement data, most significant bits 0x44 r als_data_lsb als measurement data, least significant bits part_id register (0x00) the part_id register provides part and revision identification. these values are hard ? wired at the factory and can not be modified. table 7. part_id register (0x00) bit 7 6 5 4 3 2 1 0 field part number id revision id field bit default description part number id 7:4 1001 part number identification revision id 3:0 na silicon revision number
NOA3302 http://onsemi.com 13 reset register (0x01) software reset is controlled by this register. setting this register followed by an i2c_stop sequence will immediately reset the NOA3302 to the default startup standby s tate. t riggering the software reset has virtually the same ef fect as cycling the power supply tripping the internal power on reset (por) circuitry. table 8. reset register (0x01) bit 7 6 5 4 3 2 1 0 field na sw_reset field bit default description na 7:1 xxxxxxx don?t care sw_reset 0 0 software reset to startup state int_config register (0x02) int_config register controls the external interrupt pin function. table 9. int_config register (0x02) bit 7 6 5 4 3 2 1 0 field na auto_clear polarity field bit default description na 7:2 xxxxxx don?t care auto_clear 1 1 0 when an interrupt is triggered, the interrupt pin remains asserted until cleared by an i 2 c read of interrupt register 1 interrupt pin state is updated after each measurement polarity 0 0 0 interrupt pin active low when asserted 1 interrupt pin active high when asserted ps_led_current register (0x0f) the led_current register controls how much current the internal led driver sinks through the ir led during modulated illumination. the current sink range is a baseline 5 ma plus a binary weighted value of the led_current register times 5 ma, for an effective range of 5 ma to 160 ma in steps of 5 ma. the default setting is 50 ma. table 10. ps_led_current register (0x0f) bit 7 6 5 4 3 2 1 0 field na led_current field bit default description na 7:5 xxx don?t care led_current 4:0 01001 defines current sink during led modulation. binary weighted value times 5 ma plus 5 ma. ps_th registers (0x10 ? 0x13) with hysteresis not enabled (see ps_config register), the ps_th registers set the upper and lower interrupt thresholds of the proximity detection window. interrupt functions compare these threshold values to data from the ps_data registers. measured ps_data values outside this window will set an interrupt according to the int_config register settings. with hysteresis enabled, threshold settings take on a different meaning. if ps_hyst_trig is set, the ps_th_up register sets the upper threshold at which an interrupt will be set, while the ps_th_lo register then sets the lower threshold hysteresis value where the interrupt would be cleared. setting the ps_hyst_trig low reverses the function such that the ps_th_lo register sets the lower threshold at which an interrupt will be set and the ps_th_up represents the hysteresis value at which the interrupt would be subsequently cleared. hysteresis functions only apply in ?auto_clear? int_config mode. the controller software must ensure the settings for led current, sensitivity range, and integration time (led pulses) are appropriate for selected thresholds. setting thresholds to extremes (default) effectively disables interrupts.
NOA3302 http://onsemi.com 14 table 11. ps_th_up registers (0x10 ? 0x11) bit 7 6 5 4 3 2 1 0 field ps_th_up_msb(0x10), ps_th_up_lsb(0x11) field bit default description ps_th_up_msb 7:0 0xff upper threshold for proximity detection, msb ps_th_up_lsb 7:0 0xff upper threshold for proximity detection, lsb table 12. ps_th_lo registers (0x12 ? 0x13) bit 7 6 5 4 3 2 1 0 field ps_th_lo_msb(0x12), ps_th_lo_lsb(0x13) field bit default description ps_th_lo_msb 7:0 0x00 lower threshold for proximity detection, msb ps_th_lo_lsb 7:0 0x00 lower threshold for proximity detection, lsb ps_filter_config register (0x14) ps_filter_config register provides a hardware mechanism to filter out single event occurrences or similar anomalies from causing unwanted interrupts. two 4 bit registers (m and n) can be set with values such that m out of n measurements must exceed threshold settings in order to set an interrupt. the default setting of 1 out of 1 ef fectively turns the filter off and any single measurement exceeding thresholds can trigger an interrupt. (note a setting of 0 is interpreted the same as a 1). table 13. ps_filter_config register (0x14) bit 7 6 5 4 3 2 1 0 field filter_n filter_m field bit default description filter_n 7:4 000 1 filter n filter_m 3:0 000 1 filter m ps_config register (0x15) proximity measurement sensitivity is controlled by specifying the integration time. the integration time sets the number of led pulses during the modulated illumination. the led modulation frequency remains constant with a period of 1.5 s. changing the integration time affects the sensitivity of the detector and directly affects the power consumed by the led. the default is 300 s integration period. hyst_enable and hyst_trigger work with the ps_th (threshold) settings to provide jitter control of the int function. table 14. ps_config register (0x15) bit 7 6 5 4 3 2 1 0 field na hyst_enable hyst_trigger na na integration_time field bit default description na 7:6 xx don?t care hyst_enable 5 0 0 disables hysteresis 1 enables hysteresis hyst_trigger 4 0 0 lower threshold with hysteresis 1 upper threshold with hysteresis na 3:2 x don?t care integration_time 1:0 01 00 150 s integration time 01 300 s integration time 10 600 s integration time 11 1200 s integration time
NOA3302 http://onsemi.com 15 ps_interval register (0x16) the ps_interval register sets the wait time between consecutive proximity measurements in ps_repeat mode. the register is binary weighted times 5 in milliseconds with the special case that the register value 0x00 specifies 5 ms. the range is therefore 5 ms to 1.28 s. the default startup value is 0x0a (50 ms). table 15. ps_interval register (0x16) bit 7 6 5 4 3 2 1 0 field interval field bit default description interval 7:0 0x0a 0x01 to 0xff interval time between measurement cycles. binary weighted value times 5 ms plus a 5 ms offset. ps_control register (0x17) the ps_control register is used to control the functional mode and commencement of proximity sensor measurements. the proximity sensor can be operated in either a single shot mode or consecutive measurements taken at programmable intervals. both single shot and repeat modes consume a minimum of power by immediately turning off led driver and sensor circuitry after each measurement. in both cases the quiescent current is less than the idd stby parameter. these automatic power management features eliminate the need for power down pins or special power down instructions. table 16. ps_control register (0x17) bit 7 6 5 4 3 2 1 0 field na ps_repeat ps_oneshot field bit default description na 7:2 xxxxxx don?t care ps_repeat 1 0 initiates new measurements at ps_interval rates ps_oneshot 0 0 triggers proximity sensing measurement. in single shot mode this bit clears itself after cycle completion. als_th registers (0x20 ? 0x23) with hysteresis not enabled (see als_config register), the als_th registers set the upper and lower interrupt thresholds of the ambient light detection window. interrupt functions compare these threshold values to data from the als_data registers. measured als_data values outside this window will set an interrupt according to the int_config register settings. with hysteresis enabled, threshold settings take on a different meaning. if the als_hyst_trig is set, the als_th_up register sets the upper threshold at which an interrupt will be set, while the als_th_lo register then sets the lower threshold hysteresis value where the interrupt would be cleared. setting the als_hyst_trig low reverses the function such that the als_th_lo register sets the lower threshold at which an interrupt will be set and the als_th_up represents the hysteresis value at which the interrupt would be subsequently cleared. hysteresis functions only apply in ?auto_clear? int_config mode. table 17. als_th_up registers (0x20 ? 0x21) bit 7 6 5 4 3 2 1 0 field als_th_up_msb(0x20), als_th_up_lsb(0x21) field bit default description als_th_up_msb 7:0 0xff upper threshold for als detection, msb als_th_up_lsb 7:0 0xff upper threshold for als detection, lsb
NOA3302 http://onsemi.com 16 table 18. als_th_lo registers (0x22 ? 0x23) bit 7 6 5 4 3 2 1 0 field als_th_lo_msb(0x22), als_th_lo_lsb(0x23) field bit default description als_th_lo_msb 7:0 0x00 lower threshold for als detection, msb als_th_lo_lsb 7:0 0x00 lower threshold for als detection, lsb als_config register (0x25) the als_config register controls the ambient light measurement sensitivity by specifying the integration time. hyst_enable and hyst_trigger work with the als_th (threshold) settings to provide jitter control of the int function. integration times below 50 ms are not recommended for normal operation as 50/60 hz rejection will be impacted. they may be used in testing or if 50/60 hz rejection is not a concern. table 19. als_config register (0x25) bit 7 6 5 4 3 2 1 0 field na hyst_enable hyst_trigger reserved integration_time field bit default description na 7:6 xx don?t care hyst_enable 5 0 0 disables hysteresis 1 enables hysteresis hyst_trigger 4 0 0 lower threshold with hysteresis 1 upper threshold with hysteresis reserved 3 0 must be set to 0 integration_time 2:0 100 000 6.25 ms integration time 001 12.5 ms integration time 010 25 ms integration time 011 50 ms integration time 100 100 ms integration time 101 200 ms integration time 110 400 ms integration time 111 800 ms integration time als_interval register (0x26) the als_interval register sets the interval between consecutive als measurements in als_repeat mode. the register is binary weighted times 50 in milliseconds. the range is 0 ms to 3.15 s. the register value 0x00 and 0 ms translates into a continuous loop measurement mode at any integration time. the default startup value is 0x0a (500 ms). table 20. als_interval register (0x26) bit 7 6 5 4 3 2 1 0 field na interval field bit default description interval 5:0 0x0a interval time between als measurement cycles
NOA3302 http://onsemi.com 17 als_control register (0x27) the als_control register is used to control the functional mode and commencement of ambient light sensor measurements. the ambient light sensor can be operated in either a single shot mode or consecutive measurements taken at programmable intervals. both single shot and repeat modes consume a minimum of power by immediately turning off sensor circuitry after each measurement. in both cases the quiescent current is less than the idd stby parameter. these automatic power management features eliminate the need for power down pins or special power down instructions. for accurate measurements at low light levels (below approximately 3 lux) als readings must be taken at least once per second and the first measurement after a reset (software reset or power cycling) should be ignored. table 21. als_control register (0x27) bit 7 6 5 4 3 2 1 0 field na als_repeat als_oneshot field bit default description na 7:2 xxxxxx don?t care als_repeat 1 0 initiates new measurements at als_interval rates als_oneshot 0 0 triggers als sensing measurement. in single shot mode this bit clears itself after cycle completion. interrupt register (0x40) the interrupt register displays the status of the interrupt pin and if an interrupt was caused by the proximity or ambient light sensor. if ?auto_clear? is disabled (see int_config register), reading this register also will clear the interrupt. table 22. interrupt register (0x40) bit 7 6 5 4 3 2 1 0 field na int als_inth als_intl ps_inth ps_intl field bit default description na 7:5 xxx don?t care int 4 0 status of external interrupt pin (1 is asserted) als_inth 3 0 interrupt caused by als exceeding maximum als_intl 2 0 interrupt caused by als falling below the minimum ps_inth 1 0 interrupt caused by ps exceeding maximum ps_intl 0 0 interrupt caused by ps falling below the minimum ps_data registers (0x41 ? 0x42) the ps_data registers store results from completed proximity measurements. when an i 2 c read operation begins, the current ps_data registers are locked until the operation is complete (i2c_stop received) to prevent possible data corruption from a concurrent measurement cycle. table 23. ps_data registers (0x41 ? 0x42) bit 7 6 5 4 3 2 1 0 field ps_data_msb(0x41), ps_data_lsb(0x42) field bit default description ps_data_msb 7:0 0x00 proximity measurement data, msb ps_data_lsb 7:0 0x00 proximity measurement data, lsb
NOA3302 http://onsemi.com 18 als_data registers (0x43 ? 0x44) the als_data registers store results from completed als measurements. when an i 2 c read operation begins, the current als_data registers are locked until the operation is complete (i2c_stop received) to prevent possible data corruption from a concurrent measurement cycle. table 24. als_data registers (0x43 ? 0x44) bit 7 6 5 4 3 2 1 0 field als_data_msb(0x43), als_data_lsb(0x44) field bit default description als_data_msb 7:0 0x00 als measurement data, msb als_data_lsb 7:0 0x00 als measurement data, lsb
NOA3302 http://onsemi.com 19 proximity sensor operation NOA3302 operation is divided into three phases: power up, configuration and operation. on power up the device initiates a reset which initializes the configuration registers to their default values and puts the device in the standby state. at any time, the host system may initiate a software reset by writing 0x01 to register 0x01. a software reset performs the same function as a power-on-reset. the configuration phase may be skipped if the default register values are acceptable, but typically it is desirable to change some or all of the configuration register values. configuration is accomplished by writing the desired configuration values to registers 0x02 through 0x17. writing to configuration registers can be done with either individual i 2 c byte-write commands or with one or more i 2 c block write commands. block write commands specify the first register address and then write multiple bytes of data in sequence. the NOA3302 automatically increments the register address as it acknowledges each byte transfer. proximity sensor measurement is initiated by writing appropriate values to the control register (0x17). sending an i2c_stop sequence at the end of the write signals the internal state machines to wake up and begin the next measurement cycle. figures 23 and 24 illustrate the activity of key signals during a proximity sensor measurement cycle. the cycle begins by starting the precision oscillator and powering up and calibrating the proximity sensor receiver. next, the ir led current is modulated according to the led current setting at the chosen led frequency and the values during both the on and off times of the led are stored (illuminated and ambient values). finally, the proximity reading is calculated by subtracting the ambient value from the illuminated value and storing the result in the 16 bit ps_data register. in one-shot mode, the ps receiver is then powered down and the oscillator is stopped (unless there is an active als measurement). if repeat mode is set, the ps receiver is powered down for the specified interval and the process is repeated. with default configuration values (receiver integration time = 300 s), the total measurement cycle will be less than 2 ms. figure 23. proximity sensor one ? shot timing 9 s i2c stop ps power 4mhz osc on led burst integration data available 50 ? 200 s ~600 s 8 clks 12 s integration time 0 ? 100 s 100 ? 150 s figure 24. proximity sensor repeat timing interval (repeat) 9 s i2c stop ps power 4mhz osc on led burst integration data available 50 ? 200 s ~600 s 8 clks 12 s integration time 0 ? 100 s 100 ? 150 s
NOA3302 http://onsemi.com 20 ambient light sensor operation the als configuration is accomplished by writing the desired configuration values to registers 0x02 and 0x20 through 0x27. w riting to configuration registers can be done with either individual i 2 c byte ? write commands or with one or more i 2 c block write commands. block write commands specify the first register address and then write multiple bytes of data in sequence. the NOA3302 automatically increments the register address as it acknowledges each byte transfer. als measurement is initiated by writing appropriate values to the control register (0x27). sending an i2c_stop sequence at the end of the write signals the internal state machines to wake up and begin the next measurement cycle. figures 25 and 26 illustrate the activity of key signals during an ambient light sensor measurement cycle. the cycle begins by starting the precision oscillator and powering up the ambient light sensor. next, the ambient light measurement is made for the specified integration time and the result is stored in the 16 bit als data register. if in one ? shot mode, the als is powered down and awaits the next command. if in repeat mode the als is powered down, the interval is timed out and the operation repeated. there are some special cases if the interval timer is set to less than the integration time. for continuous mode, the interval is set to 0 and the als makes continuous measurements with only a 5 s delay between integration times and the als remains powered up. if the interval is set equal to or less than the integration time (but not to 0), there is a 10 ms time between integrations and the als remains powered up. i2c stop als power 4mhz osc on integration data available 10ms integration time 5 s figure 25. als one ? shot timing 50 ? 100 s 100 ? 150 s 150 ? 200 s interval (repeat) i2c stop als power 4mhz osc on integration data available 0 ? 25ms 10ms integration time 5 s figure 26. als repeat timing 50 ? 100 s 100 ? 150 s note: if interval is set to 0 (continuous) the time between integrations is 5 s and power stays on. if interval is set to to the integration time (but not 0) the time between integrations is 10 ms and power stays on. if interval is set to > integration time the time between integrations is the interval and the als powers down.
NOA3302 http://onsemi.com 21 example programming sequence the following pseudo code configures the NOA3302 proximity sensor in repeat mode with 50 ms wait time between each measurement and then runs it in an interrupt driven mode. when the controller receives an interrupt, the interrupt determines if the interrupts was caused by the proximity sensor and if so, reads the ps_data from the device, sets a flag and then waits for the main polling loop to respond to the proximity change. external subroutine i2c_read_byte (i2c_address, data_address); external subroutine i2c_read_block (i2c_address, data_start_address, count, memory_map); external subroutine i2c_write_byte (i2c_address, data_address, data); external subroutine i2c_write_block (i2c_address, data_start_address, count, memory_map); subroutine initialize_ps () { membuf[0x02] = 0x02; // int_config assert interrupt until cleared membuf[0x0f] = 0x09; // ps_led_current 50ma membuf[0x10] = 0x8f; // ps_th_up_msb membuf[0x11] = 0xff; // ps_th_up_lsb membuf[0x12] = 0x70; // ps_th_lo_msb membuf[0x13] = 0x00; // ps_th_lo_lsb membuf[0x14] = 0x11; // ps_filter_config turn off filtering membuf[0x15] = 0x01; // ps_config 300us integration time membuf[0x16] = 0x0a; // ps_interval 50ms wait membuf[0x17] = 0x02; // ps_control enable continuous ps measurements membuf[0x20] = 0xff; // als_th_up_msb membuf[0x21] = 0xff; // als_th_up_lsb membuf[0x22] = 0x00; // als_th_lo_msb membuf[0x23] = 0x00; // als_th_lo_lsb membuf[0x25] = 0x04; // als_config 100ms integration time membuf[0x26] = 0x00; // als_interval continuous measurement mode membuf[0x27] = 0x02; // als_control enable continuous als measurements i2c_write_block (i2caddr, 0x02, 37, membuf); } subroutine i2c_interupt_handler () { // verify this is a ps interrupt int = i2c_read_byte (i2caddr, 0x40); if (int == 0x11 || int == 0x12) { // retrieve and store the ps data ps_data_msb = i2c_read_byte (i2caddr, 0x41); ps_data_lsb = i2c_read_byte (i2caddr, 0x42); newps = 0x01; } } subroutine main_loop () { i2caddr = 0x37; newps = 0x00; initialize_ps (); loop { // do some other polling operations if (newps == 0x01) { newps = 0x00; // do some operations with ps_data } } }
NOA3302 http://onsemi.com 22 physical location of photodiode sensors the physical locations of the NOA3302 proximity sensor and ambient light sensor photodiodes are shown in figure 27. 1.06 mm 0.88 mm 1.1 mm ps als pin 1 0.10 mm 0.10 mm figure 27. photodiode locations x 0.15 mm 0.15 mm x
NOA3302 http://onsemi.com 23 package dimensions cwdfn8, 2x2, 0.5p case 505aj issue o mounting footprint* dimensions: millimeters *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. 8x 0.52 0.50 pitch 1.70 2.30 8x 0.27 1.00 1 recommended notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. dimension b applies to plated terminal and is measured between 0.10 and 0.20 mm from the terminal tip. 4. coplanarity applies to the exposed pad as well as the terminals. a d e b c 0.10 pin one reference 2x top view side view bottom view l d2 e2 c c 0.05 c 0.08 a1 seating plane 8x note 3 b 8x 0.10 c 0.05 c a b b dim min max millimeters a 0.60 0.70 a1 0.00 0.05 b 0.15 0.25 d 2.00 bsc d2 1.45 1.70 e 2.00 bsc e2 0.75 1.00 e 0.50 bsc l 0.20 0.40 1 4 8 note 4 a3 0.20 ref a3 a k 0.15 ??? e 5 k e/2 c 0.10 2x on semiconductor and are registered trademar ks of semiconductor components industries, llc (s cillc). scillc owns the rights to a numb er of patents, trademarks, copyrights, trade secrets, and other intellectual property. a list ing of scillc?s product/patent coverage may be accessed at ww w.onsemi.com/site/pdf/patent ? marking.pdf. scillc reserves the right to make changes without further notice to an y products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does scillc assume any liability arising out of th e application or use of any product or circuit, and s pecifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/ or specifications can and do vary in different applications and actual performance may vary over time. all operating parameters, including ?typical s? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the right s of others. scillc products ar e not designed, intended, or a uthorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in whic h the failure of the scillc product could create a situation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized appli cation, buyer shall indemnify and hold scillc and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associ ated with such unintended or unauthorized use, even if such claim alleges that scil lc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action em ployer. this literature is subject to all applicable copyrig ht laws and is not fo r resale in any manner. publication ordering information n. american technical support : 800 ? 282 ? 9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81 ? 3 ? 5817 ? 1050 NOA3302/d literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303 ? 675 ? 2175 or 800 ? 344 ? 3860 toll free usa/canada fax : 303 ? 675 ? 2176 or 800 ? 344 ? 3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your loca l sales representative

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